Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles improve the compound's performance and long-term stability Ensure the best physical contact between the heatsink and the CPU core. Will not separate, run, migrate, or bleed. 3.5-gram
Average Particle Size: <0.49 micron <0.000020 inch Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C Long-Term: -50 Degrees C to 130 Degrees C Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.